AVS 54th International Symposium
    Plasma Science and Technology Monday Sessions
       Session PS2+MS-MoM

Invited Paper PS2+MS-MoM8
Design for Manufacturability through Design-Process Integration

Monday, October 15, 2007, 10:20 am, Room 607

Session: Plasma Etching for Advanced Interconnects I
Presenter: A. Neureuther, University of California, Berkeley
Correspondent: Click to Email

Exploratory prototype Design for Manufacturing (DFM) tools and methodologies are described. Examples will include new platforms for collaboration on process/device/circuits, visualization/quantification of manufacturing effects at the mask layout level, and fast/approximate physical modeling for first-cut design decisions. The examples have evolved from research supported over the last several years by DARPA, SRC, Industry and the U.C. Discovery Program on aberrations, illumination, polarization, CMP, plasma etching and device variation. DFM tools must enable complexity management with very fast approximate models across process, device and circuit performance with new modes of collaboration. Circuit Designers have good complexity management skills can add value by participating in this collaboration. Collaborations can be promoted by supporting multiple views of the trade-offs in terms of the natural intuitive parameters of each collaborator. Many of the nonidealities of manufacturing can be expressed at the mask plane in terms of lateral impact functions. This allows visualization and quantitative assessment of effects that are not easily captured even with large sets of design rules. Pattern Matching and Perturbation Formulation have promising exceptional speed and adequate accuracy for implementing these lateral impact assessments.