AVS 66th International Symposium & Exhibition | |
Thin Films Division | Wednesday Sessions |
Session TF1-WeM |
Session: | Vapor Deposition of Functional Polymer Thin Films and Composites |
Presenter: | Xiaoxue Wang, The Ohio State University |
Authors: | X. Wang, The Ohio State University K.K. Gleason, Massachusetts Institute of Technology |
Correspondent: | Click to Email |
In the last decade, the rapid development of the flexible and stretchable (soft) electronics has been largely fueled by the fundamental breakthrough in soft materials synthesis and new fabrication technologies. Among the soft electronic materials, polymers stand out due to their merits of high stretchability, biocompatibility, light weight, scalability and cost-efficiency. However, despite the great prospects of electronic polymers, several critical challenges still need to be addressed: (1) Key electrical properties, such as electrical conductivity (σ) and carrier mobility (μ) of polymers are still relatively low compared with conventional rigid semiconductors, and result in higher power consumption and lower operation speed; (2) Low thermal conductivity (κ) makes heat dissipation a critical issue; (3) Conventional solution-based processing technologies may pose wettability and compatibility issues for device fabrication on flexible substrates. Here we will present a synergistic approach to combat these challenges by using Chemical Vapor Deposition (CVD) technology as an effective tool. First, record high electrical conductivity (σ) and charge carrier mobility (μ) are achieved in poly(3,4-ethylenedioxythiophene) (PEDOT), with engineered crystallization and morphology implemented by CVD. We also build wafer-scale PEDOT-Si rectifier arrays operating at 13.56 MHz for RFID readers by direct CVD synthesis. Second, record high cross-plane thermal conductivity (>10x common polymers) is demonstrated in intrinsic poly(3-hexylthiophene) (P3HT) thin films by using a self-assembling CVD growth method. This method generates an extended chain structure with π- π stacking, and thereby significantly facilitates the thermal transport. Lastly, CVD’s powerful capability in device application, with gas sensors as an example, will be presented. In summary, this work establishes an innovative method to effectively tune the key physical properties of polymers by CVD-based structure-property engineering on the molecular level. In addition, this work also has the potential to facilitate novel device fabrication technologies and applications in artificial skin, bio-degradable sensors, stretchable photovoltaics and light emitting diodes (LEDs).