AVS 66th International Symposium & Exhibition
    Fundamental Aspects of Material Degradation Focus Topic Thursday Sessions
       Session DM+BI+SS-ThM

Paper DM+BI+SS-ThM13
Reflection Mode Interferometry for studying interfacial processes

Thursday, October 24, 2019, 12:00 pm, Room A212

Session: Material Stabilities and Technology for Degradation Protection
Presenter: Kai Schwenzfeier, TU Wien, Austria
Authors: K.A. Schwenzfeier, TU Wien, Austria
P. Bilotto, TU Wien, Austria
M. Lengauer, TU Wien, Austria
C. Merola, TU Wien, Austria
H.-W. Cheng, TU Wien, Austria
M. Valtiner, TU Wien, Austria
Correspondent: Click to Email

Molecular level processes at electrified solid|liquid interfaces play a critical role in corrosion and degradation processes. These include adsorption of ions, evolution of electrochemical double layers, oxidation/dissolution of metals, screening effects as well as liquid properties at an interface. However those processes/effects are notoriously hard to measure due to long integration times or too small probe with many available analysis techniques.

We refined Multiple Beam Interferometry (MBI) to enable time resolved in-situ and operando measurement of processes at solid|liquid interfaces in both transmission and reflection geometry. In this presentation dynamic interfacial processes such as changes of refractive indices in small (nanometer sized gaps), a micro-to-angstrom scale view into corrosion processes and surface oxidation, as well as specific and non-specific potential driven ion adsorption in aqueous solutions will be discussed in detail. We will relate these measurements to molecular resolution AFM imaging and force spectroscopy at solid|liquid interfaces.