AVS 66th International Symposium & Exhibition
    Chemical Analysis and Imaging Interfaces Focus Topic Thursday Sessions
       Session CA+NS+SS+VT-ThA

Invited Paper CA+NS+SS+VT-ThA10
In Situ TEM Visualization of Solution-based Nanofabrication Processes: Chemical Wet-etching and Capillary Forces

Thursday, October 24, 2019, 5:20 pm, Room A120-121

Session: Progress in Instrumentation and Methods for Spectro-microscopy of Interfaces
Presenter: Utkur Mirsaidov, National University of Singapore
Correspondent: Click to Email

Controlled fabrication of 3D nanoscale materials from semiconductors is important for many technologies. For example, scaling up the density of the transistors per chip requires the fabrication of smaller and smaller vertical nanowires as channel materials [1]. Two key processes essential to the fabrication of these devices is a precise etching of the nanostructures and the damage-free solution based cleaning (damage occurs during post-clean drying due to capillary forces). However, very little is known about both of these processes because it is extremely challenging to visualize etching and cleaning with solutions directly at the nanoscale. Here, using in situ liquid phase dynamic TEM imaging [2-4], we first describe the detailed mechanisms of etching of vertical Si nanopillars in alkaline solutions [5]. Our design of liquid cells includes a periodic array of patterned nanopillars at a density of 1.2 × 1010 cm−2. We show that the nanoscale chemical wet-etch of Si occurs in three stages: 1) intermediates generated during alkaline wet etching aggregate as nanoclusters on the Si surface, 2) then the intermediates detach from the surface before 3) dissolving in the etchant.

Next, we describe the capillary damage of these high-aspect-ratio Si nanopillars during drying after the solution-phase cleaning. Our results reveal that drying induced damage to nanopillars occurs in three distinct steps. First, as water evaporates from the surface patterned with nanopillars, water film thins down non-uniformly leaving small water nanodroplets trapped between the nanopillars. Second, the capillary forces induced by these droplets bend and bring the nanopillars into contact with each other at which point they bond together. Third, droplets trapped between the nanopillars evaporate leaving the nanopillars bonded to each other. We show that even after the nanodroplets finally evaporate, interfacial water covering the nanopillars act as a glue and holds the pillars together.

Our findings highlight the importance of being able to visualize the processes relevant to nanofabrication in order to resolve the failure modes that will occur more frequently as the device sizes get even smaller in the future.

[1] C. Thelander et al, Mater. Today 9 (2006), 28−35.

[2] M. J. Williamson et al, Nature Materials 2 (2003), p. 532.

[3] H. Zheng et al, Science 324 (2009), p. 1309.

[4] U. Mirsaidov et al, Proc. Natl. Acad. Sci. U.S.A. 109 (2012), p. 7187.

[5] Z. Aabdin et al, Nano Letters 17 (2017), p.2953.

[6] This work was supported by Singapore National Research (NRF-CRP16-2015-05).