| AVS 66th International Symposium & Exhibition | |
| Applied Surface Science Division | Thursday Sessions |
| Session AS-ThM |
| Session: | Advances in Depth Profiling, Imaging and Time-resolved Analysis |
| Presenter: | David M. Carr, Physical Electronics |
| Authors: | D.M. Carr, Physical Electronics G.L. Fisher, Physical Electronics |
| Correspondent: | Click to Email |
One common objective in research, failure analysis and reverse engineering is to ascertain the 2D/3D composition and structure of molecules in devices as a result of various processing steps. Often there is insufficient background information and a lack of reference spectra to properly interpret the analytical observations. Two device processing case studies will be presented highlighting the benefits of adding MS/MS imaging to conventional TOF-SIMS experiments. The data was acquired on a PHI nanoTOF II designed for simultaneous TOF-SIMS (MS1) imaging and tandem MS (MS2) imaging [1-4].
In the first case study, a carbon residue was observed by Auger electron spectroscopy (AES) imaging on e- beam lithography-patterned and etched device structures. TOF-SIMS tandem MS imaging was applied to characterize the composition and structure of the sub-monolayer residues. In the second case study, functionalized molecules containing bipyridine and triphenylphosphine ligands were patterned by a photolithography method and loaded with metals including Au, Pd and Pt [5]. TOF-SIMS tandem MS imaging was employed to confirm the presence and elucidate the structure of metal-organic ligands.
References
[1] G.L. Fisher, et al, Anal. Chem. 88 (2016) 6433-6440.
[2] G.L. Fisher, et al, Microscop. Microanal. 23 (2017) 843-848.
[3] C.E. Chini, et al, Biointerphases13 (2018) 03B409.
[4] T. Fu, et al, Nature Sci. Rep. (2018) accepted 06 December 2018.
[5] R. Müller and A. Welle at Karlsruhe Institute of Technology (KIT) and C. Barner-Kowollik at Queensland University of Technology (QUB) are acknowledged for providing the samples for analysis.