AVS 65th International Symposium & Exhibition
    Thin Films Division Thursday Sessions
       Session TF-ThP

Paper TF-ThP14
Development of Metal Linear Evaporator for OLED Panel Mass Production of Gen.6 half and Gen. 8 lines

Thursday, October 25, 2018, 6:00 pm, Room Hall B

Session: Thin Film Poster Session
Presenter: Jung Hyung Kim, Korea Research Institute of Standards and Science (KRISS), Republic of Korea
Authors: J.H. Kim, Korea Research Institute of Standards and Science (KRISS), Republic of Korea
M.S. Kang, Fineva Co., Republic of Korea
K.S. Shin, Fineva Co., Republic of Korea
D.M. Lim, Fineva Co., Republic of Korea
Correspondent: Click to Email
In the OLED processes, the metal layer such as Ag, Mg, or Al need to be deposited on the substrate for forming cathode. Usually metal layer is deposited by using a sputtering method in LCD panel processes. In the OLED processes, we cannot use sputtering method because of charge damage on the organic layer from the plasma. We can use only the evaporation method for the deposition of metal layer. A point evaporator has been used for metal layer deposition in the OLED process. In Gen. 6 half mass production line, the substrate hung from the ceiling is rotated to acquire good uniformity of the deposition film. In Gen. 8 mass production line, point evaporators are arrayed and the substrate is scanned on the ceiling. These method of rotation and arrays are difficult to get good uniformity. Since the distance between evaporator and substrate is very long about 1000 mm, metal usage is very low about 10 %. Therefore, the demands of metal linear evaporator has been very high in the field of mass production lines. We developed a metal linear evaporator for OLED panel mass production of Gen 6 half and Gen. 8 lines. The heating method is an inductive heating with a few tens kHz of frequency and the crucible of one body is graphite. The distance between the evaporator and the substrate is less than 500 mm. The direction of evaporation is bottom-up. The uniformity of Ag film deposited with the deposition rate of 5 A/s is less than 5 % in the length of 900 mm. Our technology can be extended to a vertical type or top-down evaporator.