AVS 65th International Symposium & Exhibition
    Thin Films Division Tuesday Sessions
       Session TF+AM+EM+PS-TuM

Paper TF+AM+EM+PS-TuM3
Nucleation of HfO2 on Si, SiO2 and TiN Substrates in PE-ALD Processes Investigated by In situ Ellipsometry and Optical Emission Specroscopy (OES)

Tuesday, October 23, 2018, 8:40 am, Room 104B

Session: Atomic Layer Processing: Area Selective Deposition
Presenter: Marceline Bonvalot, LTM, Univ. Grenoble Alpes, CEA-LETI, France
Authors: M. Bonvalot, LTM, Univ. Grenoble Alpes, CEA-LETI, France
S. belahcen, LTM, Univ. Grenoble Alpes, CEA-LETI, France
V. Pesce, LTM, Univ. Grenoble Alpes, CEA-LETI, France
A. Chaker, LTM, Univ. Grenoble Alpes, CEA-LETI, France
P. Gonon, LTM, Univ. Grenoble Alpes, CEA-LETI, France
C. Vallée, LTM, Univ. Grenoble Alpes, CEA-LETI, France
A. Bsiesy, LTM, Univ. Grenoble Alpes, CEA-LETI, France
Correspondent: Click to Email

It is generally admitted that the physical properties of ultrathin layers elaborated by ALD processes are strongly dependent upon the very initial stages of layer growth, defined as the nucleation step. This nucleation step may for instance affect the cristallinity and the texturation of the material when growing in a crystalline state, it can also significantly contribute to the sharpness of the interface between the substrate and the growing material and/or determine the layer density and surface rugosity. Moreover, this nucleation step also plays a major role in the advancement of Selective Area Deposition Processes (SALD), which are considered, as of today, as a very promising approach for the development of bottom-up routes alternative to increasingly expenseive thin layer patterning processes. In these regards, a good knowledge of the phenomena affecting the nucleation mechanisms in ALD is required.

In this work, the initial stages of layer growth has been investigated during the deposition of HfO2 by Plasma-Enhanced ALD in a FlexAL set-up equipped with an ALE (Atomic Layer Etching) bias system developed by Oxford. Four types of substrates have been put on trial for this purpose, namely, HF last treated Si(100), SiO2 (45 nm dry oxide)/Si, SiO2 (500 nm wet oxide)/Si, and TiN (15 nm ALD)/Si. Several in situ surface treatments have been applied on these substrates, prior to HfO2 ALD cycles with TEMAH as hafnium precursor. They include exposure to a plasma treatment composed of either Ar, CF4 and O2 or any mixture of these gases. A very low power (1-10 W) can be applied on the substrate to allow low DC self-bias voltage, which determines energies of ions extracted from the plasma in the vicinity of the substrate. This bias in turn allows an estimation of the contribution of both chemical and physical plasma-surface interactions to the growth mechanism. The nucleation process is followed in situ by spectroscopic ellipsometry assisted by Optical Emission Spectroscopy for the identification of plasma active species and desorbed by-products.

This presentation will describe how the nucleation time on different substrates can be successfully tuned, either delayed or accelerated, thanks to appropriate in situ surface treatment parameters, without inducing any significant perturbation in the subsequent steady state layer growth. These results will be discussed in view of literature data and potential applications to the development of selective ALD.