AVS 65th International Symposium & Exhibition
    In-situ Microscopy, Spectroscopy, and Microfluidics Focus Topic Tuesday Sessions
       Session MM-TuP

Paper MM-TuP2
NanoESCA III: Recent Progress and Applications

Tuesday, October 23, 2018, 6:30 pm, Room Hall B

Session: In-situ Microscopy, Spectroscopy, and Microfluidics Focus Topic Poster Session
Presenter: Marten Patt, Scienta Omicron GmbH, Germany
Authors: M. Merkel, FOCUS GmbH, Germany
N.B. Weber, FOCUS GmbH, Germany
M. Escher, FOCUS GmbH, Germany
T.-J. Kühn, FOCUS GmbH, Germany
M. Patt, Scienta Omicron GmbH, Germany
Correspondent: Click to Email

During the last years essential progress has been made in developing the technique of energy filtered photoemission electron microscopy (PEEM). Different approaches of imaging energy filtering have been introduced and developed more and more.

One of the most essential achievements was in 2003 the invention [1] and design of the imaging double energy analyser (IDEA), an aberration compensated band pass filter. This PEEM dedicated energy filter became the core element of the NanoESCA III instrument. Its unique design allows for high quality imaging of band pass filtered PEEM images at UV light excited threshold energies for e.g. work function mapping up to hard x-ray energies (HAXPEEM) [2] for bulk sensitive measurements.

Both the real and the momentum space of a sample can be imaged by direct switching in between both modes. The latter so called momentum microscopy, acquiring the full band structure from a microscopic sample region of interest, becomes a more and more popular alternative to the common ARPES set-up using a single hemispherical analyser. Besides elimination the major component of the analyser’s spherical aberration, the tandem arrangement also largely retains the time structure of the electron signal, unlike a single hemispherical analyser which can be helpful with time resolving experiments.

We will show some recent applications [3] and instrumental set-ups taking advantage of these possibilities.


[1] D. Funnemann, M. Escher, European Patent EP 1 559 126 B1, US patent US 7 250

599 B2

[2] Patt et al., Rev. Sci. Instrum. 85, 113704 (2014)

[3] see e.g.: Ming-Wie Chen et al., npj 2D Materials and Applications (2018) 2:2 ; doi:10.1038/s41699-017-0047-x