| AVS 63rd International Symposium & Exhibition | |
| Vacuum Technology | Tuesday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 2:20pm | VT-TuA1 Invited Paper Vacuum Design of the European Spallation Source Target Monolith System Peter Ladd, European Spallation Source, Sweden |
| 3:00pm | VT-TuA3 Achievements and Problems in the First Commissioning of SuperKEKB Vacuum System Yusuke Suetsugu, K. Shibata, T. Ishibashi, M. Shirai, S. Terui, K. Kanazawa, H. Hisamatsu, KEK, Japan |
| 4:20pm | VT-TuA7 Invited Paper Saving Megawatts in a Micron: Tailoring the Surfaces of Superconducting RF Cavities Sam Posen, Fermi National Accelerator Laboratory |
| 5:00pm | VT-TuA9 NEG Coating of Narrow-Gap Insertion Devices and Beam Pipes: Recent Achievements and Future Perspectives Paolo Manini, M. Puro, S. Raimondi, T. Porcelli, F. Siviero, E. Maccallini, G. Bongiorno, SAES Getters S.p.A., Italy |
| 5:20pm | VT-TuA10 Realisation of a Vacuum System of an EUV Exposure System Freek Molkenboer, N.B. Koster, A.F. Deutz, B.A.H. Nijland, P.J. Kerkhof, P.M. Muilwijk, B.W. Oostdijck, J. Westerhout, C.L. Hollemans, E. te Sligte, W.F.W. Mulckhuyse, M. van Putten, A.M. Hoogstrate, P. van der Walle, J.R.H. Diesveld, A. Abutan, TNO Technical Sciences, Netherlands |
| 5:40pm | VT-TuA11 Invited Paper Cleaning and Verification Strategies for UCV and UHV Components Michael Flämmich, VACOM, Vakuum Komponenten & Messtechnik GmbH, Germany, C. Worsch, S. Gottschall, R. Bauer, U. Bergner, VACOM Vakuum Komponenten & Messtechnik GmbH, Germany |