AVS 63rd International Symposium & Exhibition
    Thin Film Monday Sessions
       Session TF+PS+SE-MoA

Paper TF+PS+SE-MoA11
Plasma Characterization of Al and Cu with HIPIMS

Monday, November 7, 2016, 5:00 pm, Room 102B

Session: Plasma-based Deposition Techniques and Film Characterization
Presenter: Jason Hrebik, Kurt J. Lesker Company
Authors: J. Hrebik, Kurt J. Lesker Company
R. Bandorf, Fraunhofer Institute for Surface Engineering and Thin Films IST, Germany
H. Gerdes, Fraunhofer Institute for Surface Engineering and Thin Films IST, Germany
D. Spreemann, Fraunhofer Institute for Surface Engineering and Thin Films IST, Germany
Correspondent: Click to Email

High power impulse magnetron sputtering (HIPIMS) is a well-known technique for tailoring the coating properties in comparison to DC. In many cases the thin films were developed in smaller scale R&D facilities and afterwards transferred to industrial scaled machines. But the source configuration, magnetic field, and overall mechanical layout differs for the larger sputtering plant, and therefore a direct upscaling of the process is quite difficult. Since often the thin film properties are correlating with the plasma properties, plasma characterization is very useful tool for determining the main important parameters for a process transfer.

This investigation is focused on the plasma characterization of Al and Cu on a small circular target (3 inch) and will give a short comparison to a rectangular target (10 inch by 15 inch). As plasma properties the ion density and the optical emission was measured. The measurements were carried out in a time resoled mode and can be correlated to target voltage and current.