| AVS 62nd International Symposium & Exhibition | |
| Applied Surface Science | Tuesday Sessions |
| Session AS+NS-TuM |
| Session: | Chemical/Molecular Information from Sub-micron Features and Materials |
| Presenter: | Christopher Brundle, C R Brundle and Asociates |
| Correspondent: | Click to Email |
Some 30 years ago defects (“particles”) in wafer processing were unacceptable for sizes in the um range. Today the specification is 23nm and will soon be 19nm. These numbers are, of course, directly related to the ever decreasing dimensions of semiconductor devices. This paper gives a historical overview of the evolution of the techniques used in defect detection and characterization for both Development and Manufacturing over this period, and what might be needed in the future.
In Magnetic Storage key dimensions have decreased at a similar pace and similar defect and quality control issues obtain. Some of these will also be discussed, if there is time.
Examples are presented where possible, but there is an understandable difficulty in obtaining release for real examples of defects concerning current forefront technology!