AVS 61st International Symposium & Exhibition | |
Nanometer-scale Science and Technology | Tuesday Sessions |
Session NS+HI-TuM |
Session: | Nanopatterning and Nanolithography |
Presenter: | Douglas Ohlberg, Hewlett Packard |
Authors: | D.A.A. Ohlberg, Hewlett Packard J.P. Strachan, Hewlett Packard W. Thompson, Hewlett Packard Z.Y. Li, Hewlett Packard R.S. Williams, Hewlett Packard |
Correspondent: | Click to Email |
A novel platform has been developed to fabricate and study the performance of memristive devices smaller than 10 nm. The platform consists of free-standing silicon nitride membranes into which holes or pores with diameters ranging in size from 7nm – 50 nm have been milled with a helium ion microscope. In addition to serving as a substrate, the membrane also acts as an interlayer dielectric, and devices are fabricated by sequential deposition of materials above and below the membrane to fill the nanopore. Since deposition of the layers does not require intervening exposures to resists, developer solutions, or plasma cleans, all interfaces are clean and free of contaminants that would otherwise degrade device operation. This approach enables the compositional engineering of ideal device stacks at the nanometer scale decoupled from the problems often introduced by conventional lithographies. Working memristors are demonstrated that have been successfully fabricated around nanopores with diameters as small as 7nm. In addition, we demonstrate, how the sidewall profiles of the nanopores can be engineered in a variety of shapes from conical to hour glass by the deposition, prior to helium ion milling, of materials on the membrane that influence the scattering dynamics of the ions during milling.