AVS 61st International Symposium & Exhibition
    Electronic Materials and Processing Friday Sessions
       Session EM+EN-FrM

Paper EM+EN-FrM10
Growth of GaN on Sapphire, Si (111), and Ge/Si (111) using a Pulsed Electron Beam Deposition (PED) Process

Friday, November 14, 2014, 11:20 am, Room 311

Session: Nitrides for LED and PV Device Applications
Presenter: Nazmul Arefin, University of Oklahoma
Authors: N. Arefin, University of Oklahoma
M.H. Kane, Texas A&M University
K. Hossain, Amethyst Research Inc
B.N. Pritchett, Oklahoma Geological Survey
M.B. Johnson, University of Oklahoma
P.J. McCann, University of Oklahoma
Correspondent: Click to Email

This presentation will describe results recently obtained with pulsed electron beam deposition (PED) of GaN on sapphire, silicon (111), and 2 nm germanium coated silicon (111) substrates. The PED technique is potentially useful for growth of III-nitrides at lower substrate temperatures, a capability that can allow use of new buffer layer materials, introduction of chemically dissimilar lattice-matched materials, and help solve wafer bowing and cracking problems during growth. The introduction of this technique could lead to improvements in device quality and fabrication of vertical LED structures. In this study, GaN was deposited on sapphire at a substrate temperature of 750°C, and on silicon (111) and Ge/Si (111) at 600°C in a UHP N2 (15 mTorr) environment (without any surface pre-treatment such as pre-nitridation). A high power electron gun pulse (Neocera, Inc) was used to ablate the GaN target (1” dia. x 0.250” thick, 99.99% pure) stationed at 5 cm vertical distance from the substrate. The electron pulses were generated at 15KV, 0.3 J/pulse at 1 Hz for initial few nm of growth, and then increase to a 3 Hz pulse rate. Scanning Electron Microcopy (SEM), X-ray Diffraction (XRD), Rutherford backscattering, and optical absorption characterization were performed. SEM imaging confirms a rough surface morphology with the presence of 30 nm to 300 nm scaled GaN crystallites (for the GaN/Sapphire sample) while smaller but more coalesced crystallites of 30-50 nm size is observed for GaN/Si (111) and GaN/Ge/Si (111) samples. The average film thickness is 350 nm for the samples, yielding a growth rate of 0.16 angstrom/pulse. From SEM, it appeared that high aspect ratio filament structures have grown over the crystallites. XRD θ–2θ scans from 2θ = 0° to 2θ = 70° on the GaN on sapphire showed only two other peaks, besides the peaks from the sapphire, near 2θ = 34.6°. The peaks near 2θ = 34.6° consist of a stronger peak at 34.668° and a much weaker peak at 36.903°. These peaks correspond to the (0002) and (10-11) orientations for GaN, respectively. XRD θ–2θ scans from 2θ = 0° to 2θ = 70° on the GaN on Si (111) and GaN on Ge/Si (111) samples show presence of only polar GaN (0002) peak at 34.7° besides the Si (111) peak at 2θ = 28.5°. The XRD results clearly show that the deposited GaN material is not polycrystalline. Optical absorption spectroscopy over a 1.2 eV to 6.2 eV spectral range, for the GaN/Sapphire sample, showed an abrupt absorption edge at 3.4 eV, a clear indication of interband transitions in binary GaN. These results confirm that our PED-grown GaN is highly c-axis oriented and suitable for the initial growth of GaN on various substrate materials.