Paper 2D+AS+HI+MC+NS+PS+SP+SS-TuA9
Morphology of CVD-grown Hexagonal Boron Nitride on Cu Foils
Tuesday, November 11, 2014, 5:00 pm, Room 310
Session: |
2D Materials Characterization including Microscopy and Spectroscopy |
Presenter: |
Karthik Sridhara, University of Maryland, College Park |
Authors: |
K. Sridhara, University of Maryland, College Park W.G. Cullen, University of Maryland, College Park J.K. Hite, Naval Research Laboratory M.S. Fuhrer, Monash University, Australia D.K. Gaskill, Naval Research Laboratory B.N. Feigelson, Naval Research Laboratory |
Correspondent: |
Click to Email |
Hexagonal boron nitride (h-BN) has grown into prominence as a dielectric for graphene heterostructures. h-BN and graphene have been grown using chemical vapor deposition on various transition metal substrates. Compared to graphene, the morphology of CVD-grown h-BN on Cu has not been as widely studied. Here, we present a systematic study of the morphology of hexagonal boron nitride (h-BN) grown on polycrystalline Cu foils by chemical vapor deposition. The growth of h-BN is performed at ~1000°C in atmospheric pressure CVD with Ammonia Borane (H3NBH3) as the precursor. The copper foils, used as catalytic substrates, are thermally annealed at ~1030°C for >5 hours prior to growth and cooled slowly following growth termination. We utilized Ultra-high vacuum Scanning Tunneling Microscopy (STM), ambient AFM and SEM to assess the morphology of the CVD grown h-BN films. Highly symmetric single crystallites of h-BN are observed for sub-monolayer growth, in agreement with recent reports. We consistently observe a corrugated topographic structure within the h-BN crystallites which is distinctly different from the surrounding copper surface, and this is consistently seen in STM, AFM, and high-resolution SEM. Our aim is to understand the nature of this difference and whether it might be due to effects of differential thermal contraction between h-BN and copper. However, complications arise due to possible changes in the copper substrate topography post-growth due to surface oxidation of the copper. Preliminary results with lateral force microscopy (LFM, frictional mode) show that these corrugations are unidirectional in a single Cu grain irrespective of the orientation of the h-BN crystal and generate frictional forces 200% greater than on the surrounding copper surface, reminiscent of earlier reports of unique frictional behavior in atomically-thin membranes [1]. STM and AFM are also used to study the twin crystal boundaries of h-BN. Preliminary STM observations indicate that merging h-BN crystals consistently have a gap of about 5 nm between them. The results of this study are independent of small variations of growth conditions.
References:
[1] C. Lee, Q. Li, W. Kalb, X.-Z. Liu, H. Berger, R. Carpick, and J. Hone, “Frictional characteristics of atomically thin sheets,” Science (New York, N.Y.), vol. 328, no. 5974. pp. 76–80, 01-Apr-2010.