AVS 60th International Symposium and Exhibition
    Exhibitor Technology Spotlight Wednesday Sessions
       Session EW-WeL

Paper EW-WeL3
High Efficiency, High Capacity, and Economical “Point of Use” Gas Abatement

Wednesday, October 30, 2013, 12:40 pm, Room Hall A

Session: Exhibitor Technology Spotlight V
Presenter: D.K. Prasad, CS Clean Systems, Inc.
Authors: S. Yee, CS Clean Systems Inc.
D.K. Prasad, CS Clean Systems, Inc.
Correspondent: Click to Email
Air pollution regulations, employee health concerns, and growing awareness of toxic agents from semiconductor processes demand increased improvements in exhaust gas conditioning. The NOVASAFE® Dry Scrubber reduces the hazards associated with flammable, toxic or corrosive gases and vapors. NOVASAFE® effluent gas scrubbers offer an extremely safe and efficient way to treat toxic and corrosive gases resulting from hazard processes. This scrubber is a technologically advanced dry chemical scrubber containing approximately 2.5 gallons (9.5 liters) of scrubbing media. The scrubber is suitable for use in production and general laboratory environments. Operating passively at ambient temperature, chemical resins in the canister react on contact with process gases and by-products, converting them to non-volatile inorganic solids. NOVASAFE combines high efficiency and high capacity in a compact, in-situ solution providing compliance with appropriate exhaust gas regulations and protocol NOVASAFE is a passive abatement solution for semiconductor, vent gas, R&D and Lab instruments application. As a zero footprint scrubber, the NOVASAFE can be easily integrated with your vacuum pump system. Effluents are abated with the NOVASAFE to sub-TLV levels from roughing pumps and cryopumps. There are no moving parts. Change-outs are accomplished easily and have minimal impact on operations. With its compact and low impact design, the NOVASAFE is the ultimate uptime and economical abatement solution. Typical applications include; Etch, CVD, Implant, MOCVD, ALD, and advanced processes such as III-V Etch. The majority of semiconductor processes gases can be safely abated, including challenging gases such as; AsH3, SiH4, Cl2, F2, MO`s as examples.