| AVS 60th International Symposium and Exhibition | |
| Applied Surface Science | Monday Sessions |
| Session AS+BI-MoM |
| Session: | Organic Depth Profiling |
| Presenter: | S.R. Bryan, Physical Electronics Inc. |
| Authors: | S. Iida, ULVAC-PHI, Inc., Japan T. Miyayama, ULVAC-PHI, Inc., Japan G.L. Fisher, Physical Electronics Inc. J.S. Hammond, Physical Electronics Inc. S.R. Bryan, Physical Electronics Inc. |
| Correspondent: | Click to Email |
The recent introduction of Gas Cluster Ion Beams (GCIB) and FIB-TOF has provided new possibilities for 3D characterization of organic materials. The use of GCIB as a sputter beam for both XPS and TOF-SIMS has made it possible to acquire molecular depth profiles on a wide variety of polymers. The purpose of this study was to compare XPS and TOF-SIMS depth profiling to FIB-TOF analysis of a model Polystyrene (PS)/PS+Nylon/Nylon/PS+Nylon/PS multi-layer structure. Total thickness of the muli-layer stack is 10 um. XPS depth profiling provided quantitative analysis that could be used to calibrate the TOF-SIMS data. Both TOF-SIMS depth profiling and FIB-TOF can provide 3D characterization of the polymer stack. The TOF-SIMS data provided imaging of the heterogeneous distributions found in each of the PS+Nylon layers as well as trace molecular components found throughout the multi-layer stack. Advantages and disadvantages of both approaches to 3D analysis will be discussed using data from this polymer multi-layer model system.