AVS 59th Annual International Symposium and Exhibition
    Scanning Probe Microscopy Focus Topic Wednesday Sessions
       Session SP+AS+BI+ET+MI+NM+NS+SS+TF-WeM

Paper SP+AS+BI+ET+MI+NM+NS+SS+TF-WeM6
Atomic Scale Imaging and Electronic Structure of Trimethylaluminum Deposition on III-V Semiconductor (110) Surfaces

Wednesday, October 31, 2012, 9:40 am, Room 16

Session: Probe-Sample Interactions, Nano-Manipulation and Fabrication
Presenter: T.J. Kent, University of California San Diego
Authors: T.J. Kent, University of California San Diego
M. Edmonds, University of California San Diego
E. Chagarov, University of California San Diego
A.C. Kummel, University of California San Diego
Correspondent: Click to Email

Silicon based metal oxide semiconductor field effect transistors (Si-MOSFETs) are quickly approaching their theoretical performance limits, as a result many semiconductors are being explored as an alternative channel material for use in MOSFETs. III-V semiconductors are an appealing alternative to Si because of their higher electron mobilities. The limiting factor in III-V based MOSFET performance is defect states which prevent effective modulation of the Fermi level. The InGaAs (001) As-rich (2x4) surface contains two types of unit cells: ideal unit cells with double As-dimers and defect unit cells with single As-Dimers. The missing As-dimer unit cells, which comprise ~50% of the surface, are believed to cause electronic defect states at the semiconductor-oxide interface, specifically at the conduction band edge of the semiconductor. In-situ scanning tunneling microscopy and spectroscopy (STM/STS) and density function theory (DFT) modeling show that TMA readily passivates the As-As dimers in the ideal unit cell but the missing InGaAs(001)-2x4 may not be fully passivated by TMA. To improve the electronic structure of the interface, the sidewalls of the finFETs on InGaAs(001) can be fabricated along the (110) direction. The (110) surface contains only buckled III-V heterodimers in which the lower group III atom is sp2 hybridized with an empty dangling bond and the upper group V atom is sp3 hybridized with a full dangling bond. This results in an electrically unpinned surface.
 
To investigate the benefits of using a (110) surface as a channel material, the atomic and electronic structure of the ALD precursor trimethylaluminum (TMA) monolayer deposited on III-V (110) surfaces has been studied using in-situ STM and STS. Both GaAs and InGaAs samples were studied. GaAs wafers were obtained from Wafertech with a Si doping concentration of 4x1018/cm3. The (001) samples were cleaved ­in-situ­ to expose the (110) surface. Samples were transferred to the STM chamber (base pressure 1x10-11 torr) where the atomic bonding structure of the precursor monolayer unit cell was determined. STS, which probes the local density of states (LDOS), was used to determine Fermi level pinning. A model of TMA chemisorption was developed in which TMA chemisorbs between adjacent As atoms on the surface, giving a highly ordered monolayer with a high nucleation density which could allow for aggressive effective oxide thickness (EOT) scaling.