| AVS 59th Annual International Symposium and Exhibition | |
| Late Breaking Session | Wednesday Sessions |
| Session LB+EM+GR+MN+TR-WeA |
| Session: | Select Topics in Surface and Interface Science |
| Presenter: | L. Pei, Brigham Young University |
| Authors: | L. Pei, Brigham Young University K. Zufelt, Brigham Young University R. VanFleet, Brigham Young University R.C. Davis, Brigham Young University J. Lund, Brigham Young University K. Jones, Brigham Young University B.D. Jensen, Brigham Young University J. Abbott, Moxtek M. Harker, Moxtek M. Zappe, Moxtek S. Liddiard, Moxtek |
| Correspondent: | Click to Email |
Carbon fiber composites are very high strength materials that could be enabling materials for micro and mesoscale applications. These materials have comparable strength to silicon but are much less brittle and can achieve four times higher strain. Several challenges must be overcome before carbon fiber composite devices can be fabricated on this scale. One challenge is the fabrication of ultra-thin wafers with low void density and low surface roughness. Another challenge is the ability to reliably machine the material into desired patterns. Here we present a method for curing carbon fiber wafers (~100 μm thick) with low surface roughness, low void density, a modulus of 50 GPa, and a yield strength of ~3.6 GPa. These wafers are suitable for laser machining into high fidelity micro and mesoscale structures. We will present laser micromachined devices made from these wafers including a series of high strength support structures for ultrathin membranes and a high-dynamic-range accelerometer.