AVS 59th Annual International Symposium and Exhibition | |
Electronic Materials and Processing | Wednesday Sessions |
Session EM+OX-WeA |
Session: | Oxides and Dielectrics for Novel Devices and Ultra-dense Memory |
Presenter: | A.N. Nasir, Oregon State University |
Authors: | A.N. Nasir, Oregon State University J.F. Conley, Oregon State University |
Correspondent: | Click to Email |
MIM tunnel diodes have been proposed for high speed applications such as hot electron transistors, IR detectors, and optical rectennas for IR energy harvesting as well as backplanes for LCDs. The majority of these applications require highly asymmetric and non-linear I-V behavior at low applied voltages. The standard approach to achieving asymmetric operation in MIM devices is through the use of metal electrodes with different workfunctions (ΦM). However, the amount of asymmetry achievable using this method is limited by the ΦM difference that can be obtained using practical metals. In this work, we use an alternative approach to achieving asymmetric and non-linear operation – engineering of the insulating tunnel barrier using nanolaminate pairs of insulators with different bandgaps and band-offsets to produce asymmetric tunnel barriers. Electrons tunneling from one metal electrode to the other will see a different shape barrier depending on the direction of tunneling and the bias applied.
Recently, we found that atomic scale roughness at the bottom metal-insulator interface can dominate the I-V characteristics of MIM diodes, even overwhelming the influence of ΦM difference. By using the amorphous metal ZrCuAlNi (ZCAN) as an ultra-smooth bottom electrode in combination with high quality dielectrics deposited via ALD, we were able to fabricate MIM diodes dominated by FN tunneling. In this work, nanolaminate insulator stacks consisting of either HfO2/Al2O3, Ta2O5/Al2O3,ZrO2/Al2O3, or HfO2/ZrO2 are deposited on sputtered ZCAN bottom electrodes via ALD. Al dots form the top gate electrode.
MIIM I-V characteristics were found to be sensitive to the relative thickness as well as the arrangement of the individual dielectric layers. In the ZCAN / Al2O3 / HfO2 / Al orientation, the asymmetric tunnel barrier opposes the effect of the asymmetric ΦM, a larger current is measured at positive bias, and asymmetry is lower than for a neat Al2O3 insulator device. However, in the ZCAN / HfO2 / Al2O3 / Al orientation, the asymmetric tunnel barrier enhances the asymmetric ΦM, a larger current is measured at negative bias, and asymmetry is greater than for neat Al2O3 or HfO2 insulator devices. High asymmetry is seen when conduction in both dielectric layers is dominated by FN tunneling rather than bulk limited mechanisms. Ta2O5/Al2O3, e.g., did not show an enhancement in asymmetry.
In conclusion, we have fabricated dual insulator MIIM diodes that exhibit improved asymmetry over single layer MIM diodes. These results represent an advancement of the understanding necessary to engineer thin film based MIM tunnel devices for microelectronics applications.