| AVS 57th International Symposium & Exhibition | |
| Plasma Science and Technology | Wednesday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 2:00pm | PS1-WeA1 VUV-Induced Bond Scission and Site-Specific Nitridation in Organosilicate Glass: Bulk and Surface Effects S. Behera, University of North Texas, J. Lee, University of California-Berkeley, S. Gaddam, S. Pokharel, University of North Texas, D.B. Graves, University of California-Berkeley, J.A. Kelber, University of North Texas |
| 2:20pm | PS1-WeA2 Real-time Measurements of Material Modifications by VUV Radiation during Plasma Etching of 193nm PR F. Weilnboeck, R. Bruce, G.S. Oehrlein, University of Maryland, T.-Y. Chung, D.B. Graves, University of California, Berkeley, M. Li, D. Wang, Dow Electronic Materials, E.A. Hudson, Lam Research Corporation |
| 2:40pm | PS1-WeA3 Deciding Factors for Line-Edge-Roughness (LER) Formation and Plasma-Resistance of ArF Photoresist during Plasma Etching Processes T. Uesugi, K. Koyama, B. Jinnai, Tohoku University, Japan, S. Maeda, K. Kato, A. Yasuda, H. Momose, Mitsubishi Rayon Co., Ltd, Japan, S. Samukawa, Tohoku University, Japan |
| 3:00pm | PS1-WeA4 Smoothening of 193 Immersion Resist by 172 nm VUV Exposure E. Kunnen, A. Vaglio Pret, IMEC, Belgium, O. Luere, CNRS-LTM, France, L. Azarnouche, STMicroelectronics, France, E. Pargon, CNRS-LTM, France, P. Foubert, R. Gronheid, D. Shamiryan, M.R. Baklanov, W. Boullart, IMEC, Belgium |
| 4:00pm | PS1-WeA7 Ion and Vacuum Ultraviolet Photon Beam Effects in 193 nm Photoresist Surface Roughening: the Dependence on Polymer Structure T.-Y. Chung, D.B. Graves, University of California, Berkeley, F. Weilnboeck, G.S. Oehrlein, University of Maryland, E.A. Hudson, Lam Research Corporation, M. Li, The Dow Chemical Company |
| 4:20pm | PS1-WeA8 Polymer Surface Modification: Vibrational Sum Frequency Generation Study for Plasma Etching K. Ishikawa, K. Takeda, H. Kondo, M. Sekine, M. Hori, Nagoya University, Japan |
| 4:40pm | PS1-WeA9 Plasma-induced Mechanical Degradation of Silicon Microcantilever C.H. Huang, M. Tomura, Y. Yoshida, T. Ono, Tohoku University, Japan, S. Yamasaki, National Institute of Advanced Industrial Science and Technology (AIST), Japan, S. Samukawa, Tohoku University, Japan |
| 5:00pm | PS1-WeA10 Gas-phase Diagnostics for Understanding Plasma Processing to Tailor the Surfaces of Inorganic Thin Films and Nanoparticles K.J. Trevino, S.M. Thagard, J.C. Shearer, J.M. Stillahn, E.R. Fisher, Colorado State University |
| 5:20pm | PS1-WeA11 Wet SiO2 Etch Rate Enhancement Due To Surface Fluorination By A Remote O2/CF4 Plasma D.L. Gilbert, Mattson Technology Singapore PTE LTD |