AVS 57th International Symposium & Exhibition
    Vacuum Technology Monday Sessions
       Session VT+MN-MoM

Invited Paper VT+MN-MoM1
Practical Issues and Applications for Vacuum and Hermetic Microsystems Packaging

Monday, October 18, 2010, 8:20 am, Room Laguna

Session: MEMS Sensors, Vacuum Gauges, Measurements and Pumps
Presenter: K. Ewsuk, Sandia National Laboratories
Authors: L. Fang, Sandia National Laboratories
D. Chu, Sandia National Laboratories
K. Ewsuk, Sandia National Laboratories
Correspondent: Click to Email
Microsystems packaging involves physically placing and electrically interconnecting a microelectronic device in a package that protects it from and interfaces it with the outside world. When the device requires a hermetic or controlled microenvironment, it is typically sealed within a cavity in the package. Sealing involves placing and attaching a lid, typically by welding, brazing, or soldering. Materials selection (e.g., the epoxy die attach), and process control (e.g., the epoxy curing temperature and time) are critical for reproducible and reliable microsystems packaging. This paper will review some hermetic and controlled microenvironment packaging at Sandia Labs, and will discuss materials, processes, and equipment used to package environmentally sensitive microelectronics (e.g., MEMS and sensors).