AVS 57th International Symposium & Exhibition
    Thin Film Thursday Sessions
       Session TF-ThP

Paper TF-ThP19
Surface and Interface Characterization of ALD and PVD Thin Films for Microelectronic Applications

Thursday, October 21, 2010, 6:00 pm, Room Southwest Exhibit Hall

Session: Thin Film Poster Session II
Presenter: L. Zhang, DuPont Corporate Center for Analytical Sciences
Authors: L. Zhang, DuPont Corporate Center for Analytical Sciences
K.G. Lloyd, DuPont Corporate Center for Analytical Sciences
G. Blackman, DuPont Corporate Center for Analytical Sciences
J. Thompson, DuPont CR&D
L. Bao, DuPont Engineering
J. Ryley, DuPont Engineering
D. Reardon, DuPont CR&D
M.A. Plummer, DuPont Corporate Center for Analytical Sciences
J.R. Marsh, DuPont Corporate Center for Analytical Sciences
Correspondent: Click to Email

Surface and interface properties of thin films are critical for the growth and commercialization of microelectronics and Photovoltaics (PV) products. During the development of these thin film materials, chemical and structural characterization of surfaces at each film layer and interfaces between different layers are essential to aid product development and manufacture process for optimum products.

This presentation will focus on the applications of applying integrated methods/techniques to support thin film construction using Atomic Layer Deposition (ALD) and Physical Vapor Deposition (PVD) methods, including the study of surface composition and morphology, surface treatment, inter-layer diffusion, and film stoichiometry.