AVS 57th International Symposium & Exhibition | |
Thin Film | Thursday Sessions |
Session TF-ThP |
Session: | Thin Film Poster Session II |
Presenter: | L. Zhang, DuPont Corporate Center for Analytical Sciences |
Authors: | L. Zhang, DuPont Corporate Center for Analytical Sciences K.G. Lloyd, DuPont Corporate Center for Analytical Sciences G. Blackman, DuPont Corporate Center for Analytical Sciences J. Thompson, DuPont CR&D L. Bao, DuPont Engineering J. Ryley, DuPont Engineering D. Reardon, DuPont CR&D M.A. Plummer, DuPont Corporate Center for Analytical Sciences J.R. Marsh, DuPont Corporate Center for Analytical Sciences |
Correspondent: | Click to Email |
Surface and interface properties of thin films are critical for the growth and commercialization of microelectronics and Photovoltaics (PV) products. During the development of these thin film materials, chemical and structural characterization of surfaces at each film layer and interfaces between different layers are essential to aid product development and manufacture process for optimum products.
This presentation will focus on the applications of applying integrated methods/techniques to support thin film construction using Atomic Layer Deposition (ALD) and Physical Vapor Deposition (PVD) methods, including the study of surface composition and morphology, surface treatment, inter-layer diffusion, and film stoichiometry.