AVS 57th International Symposium & Exhibition
    MEMS and NEMS Thursday Sessions
       Session MN-ThM

Paper MN-ThM12
Analysis of a Dip-Solder Process for Self Assembly

Thursday, October 21, 2010, 11:40 am, Room Santo Domingo

Session: Multi-scale Interactions of Materials at the Micro- and Nano-scale
Presenter: M.R. Rao, University of Alabama
Authors: M.R. Rao, University of Alabama
J. Lusth, University of Alabama
S.L. Burkett, University of Alabama
Correspondent: Click to Email
Dip-soldering is a crucial step in forming certain self-assembled metal structures. However, this particular use of dip-soldering is not well described in the literature. The goal of this work is to characterize the thickness and roughness of solder layers deposited by dipping metallic films into solder melt over a range of temperatures. Control of the solder thickness and roughness will improve the yield of structures whose self-assembly is driven by surface area minimization during solder reflow. Film thickness and overall film roughness for four solder alloys, each with different melting points, were measured on unpatterned and patterned copper films. Additionally, two variations in flux treatment were investigated: flux maintained at room temperature and flux preheated to 98 °C. Findings include the determination of critical temperatures, particular to each alloy, above which the roughness and thickness of the deposited solder dramatically decreases. Preheating the flux improves the nature of the deposition below these critical points. Above the critical points, thickness and roughness of the solder vary little and preheating the flux does not provide significant improvements. This study provides insight into designing a process flow that optimizes the folding characteristics of self-assembled metal polyhedra by controlling the volume and quality of the solder layer.