| AVS 57th International Symposium & Exhibition | |
| MEMS and NEMS | Thursday Sessions |
| Session MN-ThA |
| Session: | Integration, Packaging and Reliability of MEMS and NEMS |
| Presenter: | M.P. De Boer, Sandia National Laboratories |
| Authors: | M.P. De Boer, Sandia National Laboratories D.A. Czaplewski, Argonne National Laboratory M.S. Baker, Sandia National Laboratories |
| Correspondent: | Click to Email |
Ohmic micro- and nanoswitches are of interest in numerous potential applications including phased-array radars, cell-phone circuitry, circuit breakers and power savings in advanced CMOS circuits. However, many challenges remain with respect to materials, design, packaging and reliability. An important issue is maintaining a low contact resistance as switch cycling approaches high counts. In this talk, a prototype ohmic microswitch will be presented, and its electrical performance when coated by Pt and Ru films will be compared. A whole-wafer singulation, post-processing and metallization process will be demonstrated. Then, a nanoswitch design will be introduced and initial results including processing and test will be discussed. Continued progress in micro- and nanoswitch technology will lead to insertion in multiple applications.
Sandia ia a multiprogram laboratory operated by Sandia Corporation, a Lockheed-Martin Company, for the United States Department of Energy under contract DE-AC04-94AL85000.