AVS 56th International Symposium & Exhibition | |
Plasma Science and Technology | Thursday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
2:00pm | PS2-ThA1 Absorption Spectroscopy Diagnostics of a Dual-Frequency Capacitive Dielectric Etch Tool using Ultraviolet Light-Emitting Diodes J.-P. Booth, CNRS/Ecole Polytechnique, France, J. Bredin, LPP, France, G.A. Curley, LPN/CNRS, France |
2:20pm | PS2-ThA2 On-wafer Monitoring for UV/VUV Photon Irradiation during Plasma Processes B. Jinnai, S. Fukuda, H. Ohtake, Tohoku University, Japan, E.A. Hudson, Lam Research Corp., S. Samukawa, Tohoku University, Japan |
2:40pm | PS2-ThA3 Influence of Argon Metastables on the Rotational Temperature of Nitrogen in Inductively Coupled Ar/N2 Plasmas J.-S. Poirier, J. Margot, L. Stafford, P.-M. Berube, Universite de Montreal, Canada, M. Chaker, INRS-EMT, Canada |
3:00pm | PS2-ThA4 Electron Temperatures and Electron Energy Distribution Functions in Dual Frequency Capacitively-Coupled CF4/O2 Plasmas, Measured with Trace Rare Gases-Optical Emission Spectroscopy (TRG-OES) Z.Y. Chen, V.M. Donnelly, D.J. Economou, University of Houston, L. Chen, M. Funk, R. Sundararajan, Tokyo Electron America |
3:40pm | PS2-ThA6 Invited Paper Laser and LED based Optical Diagnostic Techniques Applied in Industrial Plasma Etch Reactors N. Sadeghi, Université Joseph Fourier de Grenoble and CNRS-UJF-INPG, France, G. Cunge, D. Vempaire, M. Touzeau, R. Ramos, CNRS-UJF-INPG, France |
4:20pm | PS2-ThA8 Monitoring of Atomic H and Cl Surface Loss Kinetics by Time-Resolved Optical Emission Spectroscopy in an ICP Reactor used for Etching III-V Materials G.A. Curley, L. Gatilova, S. Guilet, S. Bouchoule, LPN-CNRS Upr20, France |
4:40pm | PS2-ThA9 Real Time Control of an Inductively Coupled Plasma Simulation B.J. Keville, M.M. Turner, Dublin City University, Ireland |
5:00pm | PS2-ThA10 Wafer Temperature Response During Plasma Etching and Applications to Chamber Matching J. Shields, C. Gabriel, Spansion, Inc. |
5:20pm | PS2-ThA11 Plasma Etch Chamber Wall Deposits – Impact on Etch Species Density and Evaluation of Cleaning Procedures D. Dictus, D. Shamiryan, V. Paraschiv, S. Degendt, W. Boullart, M.R. Baklanov, IMEC, Belgium, C. Vinckier, KU Leuven, Belgium |