AVS 56th International Symposium & Exhibition | |
Plasma Science and Technology | Friday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
8:20am | PS-FrM1 Positive Streamers Propagating Inside Bubbles in Liquids N.Yu. Babaeva, M.J. Kushner, University of Michigan |
8:40am | PS-FrM2 Atmospheric Plasma for the Degradation of Pollutants : The Promoting Effect of Water S. Al Takriti, J.M. Giet, Université Libre de Bruxelles, Belgium, C. Pierard, ArcelorMittal Research Liege, Belgium, F. Reniers, Université Libre de Bruxelles, Belgium |
9:00am | PS-FrM3 Invited Paper Challenges in the Numerical Simulation of the Plasma-Biomaterial Interaction Y. Sakiyama, D.B. Graves, University of California, Berkeley |
9:40am | PS-FrM5 A Novel Way of using Plasma to Sterilize Objects for Use in Medical, Food or Pharmaceutical Applications N.B. Koster, F.P. Wieringa, R. Koops, TNO Science and Industry, Netherlands |
10:00am | PS-FrM6 Patterned Growth of Cells and Biomolecules using a Microplasma Printing System E. Yildirim-Ayan, Drexel University, D. Pappas, Army Research Laboratory |
10:20am | PS-FrM7 How Does the Chemical Equilibrium in the Vaporous Phase Influence the Surface Properties of Poly-Parylenes? T.H.T. Huber, F. Schamberger, G. Franz, Munich University of Applied Sciences, Germany |
10:40am | PS-FrM8 Synthesis of Polystyrene and Sulfonated Polystyrene Thin Films by Atmospheric Pressure Plasma Enhanced Chemical Vapour Deposition D. Merche, Université Libre de Bruxelles (ULB), Belgium, C. Poleunis, P. Bertrand, Université Catholique de Louvain (UCL), Belgium, M. Sferrazza, F. Reniers, Université Libre de Bruxelles (ULB), Belgium |
11:00am | PS-FrM9 Functionalization of Wood Surfaces in the Afterglow of an Atmospheric Pressure Dielectric Barrier Discharge J. Prégent, Université de Montréal, Canada, F. Busnel, Université Laval, Canada, V. Blanchard, FPInnovations-Division Forintek, Canada, L. Stafford, Université de Montréal, Canada |
11:20am | PS-FrM10 Combination of Bio-template and Ultimate Top-down Etching Processes for Defect-free, High Density, Size-controlled and Excellent Uniform Si-Nanostructure for Ideal Quantum Effect Devices M. Igarashi, C. Huang, Tohoku University, Japan, M. Takeguchi, NIMS, Japan, S. Horita, JAIST, Japan, Y. Uraoka, T. Fuyuki, NAIST, Japan, I. Yamashita, Panasonic Co., Ltd. and NAIST, Japan, S. Samukawa, Tohoku University, Japan |