| AVS 56th International Symposium & Exhibition | |
| Applied Surface Science | Wednesday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 2:00pm | AS-WeA1 Invited Paper ARXPS: Power and Limitations in the Search for New Microelectronics Materials and Processes T. Conard, IMEC, Belgium |
| 2:40pm | AS-WeA3 Effects of Elastic Scattering and Analyzer-Acceptance Angle on the Analysis of Angle-Resolved XPS Data C.J. Powell, National Institute of Standards and Technology, W.S.M. Werner, W. Smekal, Vienna University of Technology, Austria |
| 3:00pm | AS-WeA4 Combining Angle-Resolved and Inelastic Background Information into Concentration-Depth Profiles; A Massively-Parallel Algorithm and a New MEMS Electron Analyzer P. Cumpson, Newcastle University, UK |
| 4:00pm | AS-WeA7 Application and Optimization of Depth Profile Reconstruction from XPS Data using the Maximum Entropy Method G.J. Mishra, Kratos Analytical Ltd, UK, D.J. Surman, Kratos Analytical, K.C. Macak, Kratos Analytical Ltd, UK |
| 4:20pm | AS-WeA8 A Case Study of Depth Profile Reconstruction from Parallel ARXPS Data by Application of a Genetic Algorithm : Characterization of a Novel, Low-Energy Plasma Treatment P. Mack, R.G. White, J. Wolstenholme, Thermo Fisher Scientific, UK, E.H. Lock, S.G. Walton, Naval Research Laboratory, D.Y. Petrovykh, Naval Research Laboratory and University of Maryland, College Park |
| 4:40pm | AS-WeA9 Advantages of AR-Hard X-ray Photoelectron Spectroscopy (HAXPES) in the Characterization of Advanced Semiconductor films. G. Conti, Y. Uritsky, Applied Materials Inc., C. Papp, C.S. Fadley, Lawrence Berkely National Laboratory |
| 5:00pm | AS-WeA10 Evaluation of ARXPS for Thickness and Composition Determination for Typical Wafer Processing Thin Films C. Brundle, C. R. Brundle and Associates, G. Conti, Applied Materials |
| 5:20pm | AS-WeA11 Development of ARHXPS System using Wide Acceptance Objective Lens and Compact Monochromatic Cr Kα X-ray Source K. Kobayashi, M. Kobata, NIMS Beamline Station at SPring-8, Japan, H. Iwai, NIMS, Japan, H. Yamazui, H Takahashi, M. Kodama, M. Suzuki, ULVAC PHI Inc., Japan, E. Ikenaga, M. Machida, J.Y. Son, SPring-8/JASRI, Japan, H. Mastsuda, H. Daimon, NAIST, Japan, H. Nohira, Tokyo City Univ., Japan |