AVS 56th International Symposium & Exhibition | |
Vacuum Technology | Monday Sessions |
Session VT-MoM |
Session: | Vacuum Contamination and Pumping |
Presenter: | S.E. Syssoev, Brooks Automation Inc. |
Authors: | S.E. Syssoev, Brooks Automation Inc. A.J. Bartlett, Brooks Automation Inc. M.J. Eacobacci, Brooks Automation Inc. |
Correspondent: | Click to Email |
Cryogenic high vacuum pumps are used on a wide variety of vacuum substrate processing equipment, space simulation systems, and analytical instruments. They produce high pumping speeds for all gases and work over a wide range of pressures. Pumping residual gases occurs by cooling them to the point that they condense on the appropriate cryogenic surface. Thus, the pumping speed of the cryopump can be converted into deposition rate of the pumped gases onto cold surfaces inside the pump. The thickness of the deposited layer is uneven due to geometry of the cryopanels inside the pump. The majority of the trapped gas forms thick and comparable stable amorphous structures, while a significantly smaller amount of the pumped gas is participating in low rate deposition on those zones inside the pump that are less exposed to the gas flow. This low rate deposition leads to formation of polycrystalline films with complicated crystallographic structure even for the simple binary gas mixture widely used in the most applications in semiconductor industry. As with any thin film, this type of polycrystalline frost can be subject to appreciable residual stress due to structural defects. The concentration of such defects depend on operating conditions such as pumped gas composition, pressure, rate of deposition, and condensation temperature. For the stressed film there is always a certain film thickness (critical thickness, [1]) after which the film can exhibit one of the possible cracking pattern – surface crack, channeling, or debond. Defects in the condensed solid gas films grown inside the cryopump can lead to spontaneous delamination resulting in frost flakes being ejected from the array surface with subsequent sublimation on the warmer surfaces of the pump. Sporadic sublimation of delaminated flakes lead to unwanted pressure variations, or bursts, inside the vacuum system. This report discusses the types of film formations found in a typical cryopumping array structure and summarizes the development of a new cryopump with increased capacity and elimination of sporadic pressure bursts occurring during the cryopumping of type II gases. The pump employs the GM refrigeration cycle and is a further modification of the Brooks Automation On-Board IS 8F cryopump [2]. The test results showing pressure bursts free operation and 50% higher capacity for type II gas achieved with no changes to cryopump external geometry are presented and discussed.
[1]. J.Hutchinson et al. Mixed mode cracking in layered material. Advances in applied mechanics, 29, 63 (1992).
[2]. A.J.Bartlett et al. Pressure burst free high capacity cryopump. United States Patent Application 20080168778, (2008).