Invited Paper TF-ThA3
Etching Technology for Patterned Media used for Ultra High Density Hard Disk Drive

Thursday, November 12, 2009, 2:40 pm, Room B4

Patterning of magnetic recording media is one of the proposed approaches for extending magnetic storage densities beyond 1Tbit/in2. This approach is based on patterning the recording media into magnetically separated areas, which can be used for storing a single bit of information. Here we introduce the etching technology and equipment for discrete track recording media (DTM) mass-production. A unique requirement for magnetic recording media patterning system is that the system should be able to etch both sides of the media. Furthermore, since a typical media sputtering time in a process chamber is less than 4 seconds, a reasonably high etching rate approach is necessary. To this end, we developed reactive ion etching (RIE) and ion beam etching (IBE) modules based on inductive coupled plasma (ICP) source. The advantages of using the ICP source are the high density plasma

and the plasma are confined within the cavity. The high density plasma contributes to high etching efficiency. The confined plasma minimized the interference of ICP sources and enable the mounting of RIE or IBE modules facing each other. Recent etching results using RIE and IBE modules will be presented, and the feasibility of our approach for mass-production of DTM will be discussed.