AVS 53rd International Symposium
    MEMS and NEMS Tuesday Sessions
       Session MN-TuP

Paper MN-TuP8
Controlling the Silicon Micro-grass in Fabrication of Deeply Etched Silicon Structures using Adaptive Bosch Process

Tuesday, November 14, 2006, 6:00 pm, Room 3rd Floor Lobby

Session: Aspects of MEMS and NEMS Poster Session
Presenter: M.W. Lee, INHA University, South Korea
Authors: M.W. Lee, INHA University, South Korea
B.S. Kim, INHA University, South Korea
J.H. Sung, INHA University, South Korea
S.B. Jo, INHA University, South Korea
C.H. Choi, INHA University, South Korea
E.H. Lee, INHA University, South Korea
S.-G. Park, INHA University, South Korea
S.G. Lee, INHA University, South Korea
B.H. O, INHA University, South Korea
Correspondent: Click to Email
A deeply etched silicon structure provides an easy way to realize an embossing master, compared with a conventional Ni master. But, the silicon micro-grass which usually occurs during silicon deep etch process have to be suppressed for subsequent embossing process. We tried to control the silicon micro-grass by changing etching conditions of our silicon deep etching method, named adaptive bosch process. Etch/passivation time ratios, bias powers and other process parameters are varied, and the fabrication results are compared. Mainly, etch/passivation time ratio variation showed good control of the silicon micro-grass, and other parameters also have effect to control the micro-grass. Detailed discussions will be presented.