AVS 53rd International Symposium
    MEMS and NEMS Tuesday Sessions
       Session MN-TuA

Paper MN-TuA9
Molecular Vapor Deposition Integration with MEMS Manufacturing

Tuesday, November 14, 2006, 4:40 pm, Room 2007

Session: Fabrication and Characterization of MEMS and NEMS
Presenter: B. Kobrin, Applied Microstructures, Inc.
Authors: B. Kobrin, Applied Microstructures, Inc.
T. Zhang, Applied Microstructures, Inc.
N. Dangaria, Applied Microstructures, Inc.
J. Chinn, Applied Microstructures, Inc.
Correspondent: Click to Email
Molecular vapor deposition (MVD) has already proved itself as enabling technique for anti-stiction prevention and yield enhancement in MEMS devices.@footnote 1,2@. We report on results of MVD process integration with MEMS manufacturing schemes. Vacuum type deposition and self-assembling nature of the coating assures excellent conformality in high aspect ratio structures and narrow air gaps between released components and a substrate. It also enables seamless integration in MEMS back-end process flow. We demonstrated successful deposition of self-assembled monolayers (SAM) through small (micron-size) openings in encapsulated MEMS package. Different selective material deposition and removal techniques (lift-off, substrate masking, UV ozone etch, oxygen plasma) allow integrating MVD process into MEMS back-end packaging and Ink-jet head assembly processes. Some examples of this integration are reported. @FootnoteText@@footnote 1@B. Kobrin , J. Chinn , W. Ashurst, Durable Anti-Stiction Coatings by Molecular Vapor Deposition (MVD), NSTI Nanotech, May 2005 @footnote 2@B. Kobrin, W. Ashurst, V. Fuentes, R. Nowak, R. Yi, Jeff Chinn, Molecular Vapor Deposition for Enhanced Monolayer Stability and Durability, AIChE2005, Nov 2005.