AVS 53rd International Symposium
    Exhibitor Workshop Tuesday Sessions
       Session EW-TuL

Paper EW-TuL1
Applications of a New TOF-SIMS Tool for 300 mm Wafer Inspection

Tuesday, November 14, 2006, 12:20 pm, Room Exhibit Hall

Session: Exhibitor Workshop
Presenter: R. Moellers, ION-TOF GmbH, Germany
Authors: E. Niehuis, ION-TOF GmbH, Germany
R. Moellers, ION-TOF GmbH, Germany
T. Grehl, ION-TOF GmbH, Germany
D. Rading, ION-TOF GmbH, Germany
F. Kollmer, ION-TOF GmbH, Germany
Correspondent: Click to Email
We have developed a new fully automated and cleanroom compatible TOF-SIMS tool with FOUP loading for 300 mm wafer inspection. The instrument and its automation is designed to apply a variety of recipes for various analytical tasks. We will describe the instrument performance and discuss various applications of this tool in semiconductor industry like trace metal detection, detection of organic contaminants, analysis of gate dielectrics and ultra-shallow implant dosimetry.