AVS 52nd International Symposium
    Advanced Surface Engineering Tuesday Sessions
       Session SE-TuP

Paper SE-TuP2
Low Temperature Deposition of @alpha@-Al@sub 2@O@sub 3@ by Plasma Chemical Vapor Deposition

Tuesday, November 1, 2005, 4:00 pm, Room Exhibit Hall C&D

Session: Advanced Surface Engineering Poster Session
Presenter: D. Kurapov, RWTH Aachen, Germany
Authors: D. Kurapov, RWTH Aachen, Germany
J.M. Schneider, RWTH Aachen, Germany
Correspondent: Click to Email
Al@sub 2@O@sub 3@ coatings were deposited on tempered hot working steel substrates (X38CrMoV5-1) by plasma enhanced chemical vapor deposition. The influence of the substrate temperature on the constitution of the alumina films was investigated in the temperature range from 500 to 600 °C and normalized ion flux values of 100, 140, 270, and 480. The constitution of the deposited films was analyzed by grazing incidence x-ray diffraction (GIXRD). Additional information about phases formed was obtained from atomic force microscopy (AFM) of polished films. It was found that the phase formation was strongly affected by the normalized ion flux. Alpha Al@sub 2@O@sub 3@ films were obtained at a growth temperature as low as 500 °C. The hardness and elastic modulus of the deposited films were evaluated by nanoindentation. The correlation between deposition parameters and mechanical properties of Al@sub 2@O@sub 3@ films can be understood in terms of the density reduction due to changes of the ion flux. It was found that maximum hardness and elastic modulus values were obtained at low normalized ion flux values.