AVS 52nd International Symposium
    Electronic Materials and Processing Wednesday Sessions
       Session EM+SS-WeM

Paper EM+SS-WeM7
Top-contact Junctions for Molecules Electronics: Nano-transfer Printing

Wednesday, November 2, 2005, 10:20 am, Room 309

Session: Contacts to Organic and Molecular Devices
Presenter: K. Ojima, Osaka University, Japan
Authors: K. Ojima, Osaka University, Japan
K. Nakamatsu, University of Hyogo, Japan
Y. Otsuka, Osaka University, Japan
T. Matsumoto, Osaka University, Japan
S. Matsui, University of Hyogo, Japan
T. Kawai, Osaka University, Japan
Correspondent: Click to Email
Recently, nanotransfer printing (nTP) attracts an attention as a method of producing the electrode. The electrode fabricated by nTP give the solutions for the problems of bottom contact-type electrode because electrodes are fabricated directly on the substrate after the deposition of molecules. In the previous reports, the nTP process needed chemical modification for the substrate in order to obtain well adhesiveness between the electrode and the substrate. This requirement has been serious limitation to fabricate molecular-scale devices. We have developed a nTP process for molecular devices without any modifications of substrate surfaces and evaluated the electrical properties of the electrodes fabricated by nTP. The use of the release agent enables us to print electrodes without any surface modification and heating the substrate. A test pattern of gold electrodes formed by the nTP on a DNA spread SiO2/Si substrate was examine by AFM. We found that the resistivity of a line of gold electrode is nearly equal to that of bulk gold. We also examined the electric contact between the electrodes and molecules using Kelvin force microscopy (KFM) under applying bias voltage to the electrode/molecules junctions. We will present the images of electric potential distribution for the junctions.