| AVS 51st International Symposium | |
| Plasma Science and Technology | Tuesday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 8:20am | PS1-TuM1 Polymer Formation in Fluorocarbon Etch Plasmas B. Ji, S. Dheandhanoo, S.A. Motika, P.R. Badowski, J.R. Stets, E.J. Karwacki, Air Products and Chemicals, Inc. |
| 8:40am | PS1-TuM2 Reduction of Line Edge Roughness for 90nm Technology Node for Contact and Trench Etched Features D. Farber, W. Dostalik, B. Goodlin, R. Kraft, T. Lii, Texas Instruments |
| 9:00am | PS1-TuM3 Effect of Non-sinusoidal Bias Voltage Waveforms on Ion Energy Distributions and SiO@sub 2@/Si Etch Selectivity in Fluorocarbon Plasmas@footnote 1@ A. Agarwal, M.J. Kushner, University of Illinois at Urbana-Champaign |
| 9:20am | PS1-TuM4 Dielectric Processes Enhancements Using Multifrequency Sheath Modulation S.C. Shannon, A.M. Paterson, T. Panagopoulos, D. Hoffman, J.P. Holland, Applied Materials, Inc., D. Grimard, University of Michigan |
| 9:40am | PS1-TuM5 A Novel Etching Process Employing Pulse-Modulated Electron-Beam-Excited Plasma for Fabrication of Micro-Optical Devices K. Takeda, Nagoya University, Japan, Y. Tomekawa, T. Ohta, Wakayama University, Japan, K. Yamakawa, Nagoya University, Japan, M. Ito, Wakayama University, Japan, M. Hori, Nagoya University, Japan |
| 10:00am | PS1-TuM6 Surface Kinetics Modeling for Silicon Oxide and OSG Etching in Fluorocarbon Plasmas O. Kwon, B. Bai, H.H. Sawin, Massachusetts Institute of Technology |
| 10:20am | PS1-TuM7 Study on Self-aligned Contact Oxide Etching Using C@sub 5@F@sub 8@/O@sub 2@/Ar and C@sub 5@F@sub 8@/O@sub 2@/Ar/CH@sub 2@F@sub 2@ Plasma S.B. Kim, D.G. Choi, D.S. Kim, Y.W. Song, Hynix Semiconductor Inc., Korea, C.I. Kim, Chung-ang University, Korea |
| 10:40am | PS1-TuM8 Advanced Inductive Plasma Etcher for Low-k Materials and Oxide G. Vinogradov, A. Kelly, V.M. Managarishvilil, Y. Hirano, FOI Corporation, Japan |
| 11:20am | PS1-TuM10 Impact of Vibrational States on Dissociation in Fluorocarbon and Hydrogenated Fluorocarbon Plasmas S. Adamson, K. Novoselov, A. Dement'ev, V. Kudrja, Soft-Tec, Russia, S. Rauf, P.L.G. Ventzek, Freescale Semiconductor |
| 11:40am | PS1-TuM11 Measuring Macro- and Micro-loading Impact on Etch Bias H.P. Stadniychuk, Cypress Semiconductor |