| AVS 50th International Symposium | |
| Electronic Materials and Devices | Thursday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 8:20am | EM-ThM1 Invited Paper Self-aligned Silicides for Ohmic Contacts in CMOS Technology: TiSi@sub 2@, CoSi@sub 2@ and NiSi S.-L. Zhang, KTH, Sweden |
| 9:00am | EM-ThM3 Ni-Si Thin Films Reactions at Low Temperatures: Phase Identification and Sequence Characterization C. Coia, École Polytechnique de Montréal, Canada, C. Lavoie, IBM Research, M. Tremblay, École Polytechnique de Montréal, Canada, C. Detavernier, F.M. d'Heurle, IBM Research, P. Desjardins, École Polytechnique de Montréal, Canada |
| 9:20am | EM-ThM4 Invited Paper Development of Ohmic Contact Materials for Compound Semiconductors M. Murakami, M. Moriyama, S. Tsukimoto, Kyoto University, Japan |
| 10:00am | EM-ThM6 Indium-Based Ohmic Contacts to n-Type Gallium Antimonide J.A. Robinson, S.E. Mohney, The Pennsylvania State University |
| 10:20am | EM-ThM7 Long and Short Term Thermal Stability of Gate Metallizations on GaN/AlGaN/GaN Heterostructures E.D. Readinger, S.E. Mohney, Penn State University, R. Therrien, Nitronex Corp. |
| 10:40am | EM-ThM8 Compositional Shift in Al@sub x@Ga@sub 1-x@N Induced by Reaction with Metallic Thin Films B.A. Hull, E.D. Readinger, S.E. Mohney, The Pennsylvania State University, U. Chowdhury, R.D. Dupuis, The University of Texas at Austin |
| 11:00am | EM-ThM9 Low Temperature Chemical Vapor Deposition and Characterization of Ultra-thin Ruthenium for Copper Diffusion Barriers in ULSI Interconnects Q. Wang, Y.-M. Sun, D. Gay, J.M. White, J.G. Ekerdt, University of Texas at Austin |
| 11:20am | EM-ThM10 Evaluating Ruthenium Thin Film Deposited on Silicon as a Directly Plate-able Cu Diffusion Barrier O. Chyan, University of North Texas, T.G. Hurd, Texas Instruments, R.M. Wallace, M.J. Kim, R. Chan, T. Arunagiri, University of North Texas |
| 11:40am | EM-ThM11 ZrB@sub 2@ Diffusion Barriers: Conformal CVD Below 400 °C E.J. Klein, D.-Y. Kim, S. Jayaraman, G.S. Girolami, J.R. Abelson, University of Illinois at Urbana-Champaign |