AVS 50th International Symposium
    Microelectromechanical Systems (MEMS) Tuesday Sessions
       Session MM-TuP

Paper MM-TuP4
Vacuum Encapsulation of Micron-Sized Vacuum Field Emission Triodes

Tuesday, November 4, 2003, 5:30 pm, Room Hall A-C

Session: Poster Session
Presenter: S.J. Randolph, University of Tennessee, Knoxville
Authors: S.J. Randolph, University of Tennessee, Knoxville
M.A. Guillorn, University of Tennessee, Knoxville and Oak Ridge National Lab
M.D. Hale, University of Tennessee, Knoxville
P.D. Rack, University of Tennessee, Knoxville
Correspondent: Click to Email
In recent years, carbon nanotubes have shown promise for use as stable field emitting elements in gated cathode devices. Vacuum conditions are ideal for the operation of field emission triodes, however, issues of practicality require that they be able to function outside the confines of a vacuum chamber. For this reason, a microfabrication technique has been developed for encapsulating a field emission triode in a micron-sized, vacuum-sealed environment. Patterned photoresist is thermally treated in order to form a temporary structural mold covering the device. The effects of photoresist thickness and geometry are being studied in order to minimize the duration and temperature requirements of this treatment process. The photoresist mold is then metallized and a reactive ion etch (RIE) process is used to create vias for photoresist removal. Also under investigation are the relationships between the film stresses and structural stability of the devices. Upon removal of the photoresist, a final metallization by an evaporation process is used to seal the structure under vacuum conditions. In this presentation the process flow for the vacuum micro-encapsulation package will be described and the materials requirements will be enumerated.