AVS 49th International Symposium
    Manufacturing Science and Technology Monday Sessions
       Session MS+SE-MoM

Invited Paper MS+SE-MoM7
Real Time in situ Spectroellipsometry

Monday, November 4, 2002, 10:20 am, Room C-109

Session: In-Situ Monitoring and Metrology for Coating Growth and Manufacturing
Presenter: J.A. Woollam, J. A. Woollam Co., Inc.
Authors: J.A. Woollam, J. A. Woollam Co., Inc.
B. Johs, J. A. Woollam Co., Inc.
J. Hale, J. A. Woollam Co., Inc.
Correspondent: Click to Email
This talk reviews applications of spectroscopic ellipsometry for in situ monitoring and control during deposition, thermal processing, and etching of surfaces and thin-films. In situ spectroscopic ellipsometry is valuable for calibrating film growth and etch rates, controlling the thickness of each layer in multi-layer structures, and investigating nucleation phenomenon. It is also useful for measuring surface and interfacial roughness, substrate and film optical constants (with and without surface oxides), alloy composition, and substrate temperature. There have been numerous challenges to implementing in situ spectroscopic ellipsometry, including how to deal with substrate wobble and the effects of windows, and how to accurately measure thickness and material properties during growth of large numbers of layers in multi-layer stacks. Solutions to these practical problems will be discussed, and example applications described.