AVS 49th International Symposium
    Manufacturing Science and Technology Tuesday Sessions
       Session MS+MM-TuA

Invited Paper MS+MM-TuA9
Manufacturing Issues of Automotive Sensors produced at Bosch

Tuesday, November 5, 2002, 4:40 pm, Room C-109

Session: Manufacturing Issues in MEMS and Related Microsystems
Presenter: M. Offenberg, Robert Bosch GmbH, Germany
Correspondent: Click to Email

An ever increasing number of electronic systems in vehicles helps to increase the safety and comfort of the driver as well as to increase fuel efficiency and to reduce toxic emissions. Sensors are enabling components for the functionality of these electronic systems. Over the last decade microfabrication technologies have contributed to reduce the cost of these sensors - and thus overall system cost - while at the same time increasing their functionality and reliability. This paper describes selected micro sensors that have been successfully introduced to the market such as pressure sensors, mass flow sensors, acceleration and angular rate sensors. Manufacturing aspects and processes with and without monolithic integration are illustrated for a surface micro-machining process. The embedding of MEMS manufacturing in an existing 6-inch ASIC production environment to achieve an optimized low-cost process is described. Key process steps such as deposition of mechanical-grade thick poly-silicon layers, trench etching, sacrificial oxide etch and hermetic sealing are illustrated. Some of the key processes require dedicated equipment that was developed in collaboration with equipment manufacturer. High rate silicon deep silicon etcher in cluster tools ensure low cost of ownership. Process monitors for mechanical stress and stress gradient will be presented and manufacturing issues such as cross contamination and particle protections are discussed using inertial sensors as an example.