MEMS(MicroElectroMechanical Systems) use IC(Integrated Circuit) manufacturing technology for the fabrication of sensors and actuators that utilize a wide variety of transduction principles to interact with the physical world. The three dimensional aspects of the sensor require some additional process technology that is not available in conventional IC technology. Also, since many of these sensors and actuators require the presence of intentional gaps in which mechanical motion is initiated, MEMS technology also require methods to form these intentional gaps. Using this enabling technology, a number of high volume sensors have been developed for the mainstream market in the automotive, consumer, industrial and medical segments. However, as the trend in IC manufacturing has progressed towards more shallower and planar technology, the trend in MEMS technology has moved towards high aspect ratio structures. The issues related to manufacturing of sensors and actuators using MEMS technology will be discussed. Some of the specific requirements of the process technology to enable well-controlled high volume manufacturing of sensors will be presented. In addition, examples of failure mechanisms that result from the interaction of design and the fabrication process will be discussed. The choices in the integration of these sensors and actuators with the system circuitry will also be presented.