Click a paper to see the details. Presenters are shown in bold type.
| 9:40am | MS-MoM1 Invited Paper Optical Digital Profiling for Production Applications K. Barry, J. Kretzschmar, N. Jakatdar, Timbre Technologies, Inc. |
| 10:20am | MS-MoM3 Critical Dimension and Profile Measurement by Optical Scatterometry for Sub-0.15 µm Advanced Gate and Shallow Trench Isolation Structures D. Mui, H. Sasano, J. Yamatino, M.S. Barnes, K. Fairbarn, Applied Materials |
| 10:40am | MS-MoM4 Wafer Inspection with HDI Surface Reflectance Analyzer A. Surdutovich, G. Conti, H.T. Nguyen, H. Hao, Applied Materials, G.H. Vurens, HDI Instrumentation |
| 11:00am | MS-MoM5 Invited Paper Using SQUIDs for Failure Analysis in the Semiconductor Industry T. Venkatesan, L.A. Knauss, A. Schwartz, Neocera, Inc. |
| 11:40am | MS-MoM7 Development of a 300 mm Wafer Defect Analysis Tool Integrating High Resolution Auger Spectroscopy and Ultrahigh Resolution Immersion Lens SEM Microscopy W.K. Ford, M. Jaehnig, P. Hudson, Intel Corporation, T. Dingle, K. Troost, L. Christman, J. Jackman, M. Verheijen, FEI Company, P. Belcher, Thermo VG Scientific |