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    Manufacturing Science and Technology Monday Sessions
       Session MS-MoM

Paper MS-MoM4
Wafer Inspection with HDI Surface Reflectance Analyzer

Monday, October 29, 2001, 10:40 am, Room 131

Session: Metrology and Inspection for Manufacturing
Presenter: A. Surdutovich, Applied Materials
Authors: A. Surdutovich, Applied Materials
G. Conti, Applied Materials
H.T. Nguyen, Applied Materials
H. Hao, Applied Materials
G.H. Vurens, HDI Instrumentation
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Scanning Reflectance Analysis (SRA) is being widely used in the hard disk industry for metrology of thin film disks. The technique has been evaluated for wafer inspection. This technique provides a means to generate high resolution maps of thickness variation and empirical chemistry variation of films on a wafer in less than one minute. Low k CVD films have been measured with HDI SRA and an application has been developed for mapping out separately chemical and thickness variations across the whole wafer area. Detection of organic contamination on Cu seed film has also been investigated.