IUVSTA 15th International Vacuum Congress (IVC-15), AVS 48th International Symposium (AVS-48), 11th International Conference on Solid Surfaces (ICSS-11)
    Manufacturing Science and Technology Tuesday Sessions
       Session MS-TuM

Paper MS-TuM1
Reduction in Loadlock Vent Time and Particles through Use of Fast Vent Diffuser

Tuesday, October 30, 2001, 8:20 am, Room 131

Session: Process Integration and Factory Productivity
Presenter: J. Snow, Mykrolis Corporation
Authors: C. Adcock, Mykrolis Corporation (Formerly the Microelectronics Division of Millipore Corporation)
H. Dang, Texas Instruments Inc.
J. Gratz, Mykrolis Corporation
M. Randolph, Mykrolis Corporation
J. Snow, Mykrolis Corporation
C. Tsourides, Mykrolis Corporation
R. Wheeler, Millipore Corporation
Correspondent: Click to Email
Improvements to semiconductor manufacturing equipment effectiveness can be directly impacted by enhancements in tool throughput and/or product yield. One area for these improvements is system loadlocks. Reducing loadlock vent-up time from vacuum to atmospheric pressure increases tool throughput. Additionally, reducing particle adders in the loadlock increases product yield. Traditionally, a soft vent procedure has been used in an attempt to balance loadlock vent-up time with reduced particle generation. While some particle control is achieved, vent-up times are often in excess of ten minutes - not an optimal solution. Gas diffuser technology has been developed and integrated with filtration technology to enable faster vent-up of loadlocks while simultaneously decreasing particle adders on the wafer. This is accomplished using a "specially formulated" sintered porous metal membrane, which provides laminar flow across the entire diffuser surface. Vent gas volume is maximized while gas velocity at the loadlock entrance is minimized. Results from two independent evaluations with diffusers will be presented. First, tests conducted at an equipment manufacturer will demonstrate an 80% reduction in vent time with no adverse effect on particle performance. Second, on-tool performance at a semiconductor manufacturing facility will highlight the reduction in wafer particle adders.