IUVSTA 15th International Vacuum Congress (IVC-15), AVS 48th International Symposium (AVS-48), 11th International Conference on Solid Surfaces (ICSS-11)
    Manufacturing Science and Technology Tuesday Sessions
       Session MS-TuA

Invited Paper MS-TuA5
Fault Identification and Classification using a Plasma Impedance Monitor

Tuesday, October 30, 2001, 3:20 pm, Room 131

Session: In Line and In Situ Process Control
Presenter: M.P. Hopkins, Scientific Systems, Ireland
Authors: M.P. Hopkins, Scientific Systems, Ireland
K. O’Leary, Scientific Systems, Ireland
Correspondent: Click to Email

Semiconductor production fabs regularly encounter faults which result in unscheduled tool downtime. Among these are real-time tool faults, preventative maintenance recovery problems and tool mis-matching at start-up and process transfer. This downtime can be reduced by applying a Fault Detection and Classification scheme where the core problem is identified as rapidly as possible, replacing the usual "trial-and-error" approach to fault identification. Scientific Systems have developed a non-intrusive, high-resolution impedance sensor which is designed to aid fault identification. The sensor is used to characterize a baseline process, operating within control limits, by measuring the Fourier components of RF voltage, current and phase. This results in a unique impedance fingerprint of the chamber. When a fault condition occurs, the impedance fingerprint varies in a predictable pattern. By comparing the fault fingerprint to the baseline, it is possible to classify faults through a diagnostic methodology. Using the system, hardware problems can be separated from process issues and changes in individual process inputs can be identified. We report a number of case studies where the system has been successfully deployed.