IUVSTA 15th International Vacuum Congress (IVC-15), AVS 48th International Symposium (AVS-48), 11th International Conference on Solid Surfaces (ICSS-11)
    Advancing toward Sustainability Topical Conference Tuesday Sessions
       Session AT-TuA

Paper AT-TuA5
Reducing PFC Emissions from a Semiconductor Wafer Fab: Optimization of Chamber Clean Processes for the CVD Tool Set

Tuesday, October 30, 2001, 3:20 pm, Room 111

Session: Sustainable Climate-Friendly Semiconductor Manufacturing
Presenter: A.D. Johnson, Air Products and Chemicals, Inc.
Authors: A.D. Johnson, Air Products and Chemicals, Inc.
C. Deuper, Philips Semiconductor, The Netherlands
Correspondent: Click to Email
Perfluorocompound (PFC) gases (e.g., CF4, C2F6, and NF3) are used extensively in semiconductor manufacturing for cleaning CVD chambers following thin film deposition. PFCs, however, have large global warming potentials (GWPs) and are suspected of contributing to global climate change. Responding to this concern, the global semiconductor industry has voluntarily agreed to minimize its PFC emissions. Reduction targets for the US, Europe and Japan are 10 % of 1995 levels by the year 2010. Achieving these targeted reductions requires all processes using PFCs be optimized. Process optimization involves reducing emissions, and usage, of PFCs while maintaining the same, or reducing, the cycle time. This report describes how optimized chamber clean processes were identified for the CVD tool set.