AVS 47th International Symposium
    Vacuum Technology Wednesday Sessions
       Session VT-WeP

Paper VT-WeP14
Rapid Cool Dual Slot Load Locks For LCD

Wednesday, October 4, 2000, 11:00 am, Room Exhibit Hall C & D

Session: Poster Session
Presenter: A. Hosokawa, Applied Materials Inc.
Authors: A. Hosokawa, Applied Materials Inc.
W. Blonigan, Applied Materials Inc.
S. Kurita, Applied Materials Inc.
Correspondent: Click to Email
Rapid cooling of 680mm x 880mm glass substrate was demonstrated in the dual slot load locks @footnote 1@ of Applied Materials AKT 5500 CVD system. It takes 33 sec to cool the substrate from 400°C to 60°C with the uniformity of ±5°C. To accomplish this, two techniques were used. Helium equivalent to partial pressure of 9 torr was injected at the initial stage of venting. Two cooling plates were located above and below the substrate and the distance of the cooling plates was reduced to 8 mm when cooling. Rapid cool dual slot load locks reduced the system cost by eliminating expensive machined components and a more powerful pump. Uniform cooling enabled reliable substrate handling and eliminated undesirable stress on the substrate upon cooling compared with the conventional 12 slot load locks. @FootnoteText@ @footnote 1@ Shinichi Kurita, Wendell Blonigan, Akihiro Hosokawa, US Patent pending #7828.7017, Dec 1999.