AVS 47th International Symposium
    Incorporating Principles of Industrial Ecology Tuesday Sessions
       Session IE-TuA

Invited Paper IE-TuA8
Advanced Chemicals for Semiconductor Processing

Tuesday, October 3, 2000, 4:20 pm, Room 304

Session: Green Manufacturing
Presenter: E.R. Sparks, ATMI
Authors: E.R. Sparks, ATMI
W. Wojtczak, ATMI
S.A. Fine, ATMI
Correspondent: Click to Email
Three of the challenges to semiconductor processing are shrinking dimensions, copper metallization, and low-k dielectric materials. These challenges have been successfully addressed with a new group of water-based chemicals that fortuitously have very favorable properties. - As lithographic dimensions shrink, etching and other processing parameters become more stringent. The residues created from photoresist during these proceses often incorporate fluorocarbon residues, and silicon and metal oxides that are impossible to remove with traditional chemicals. - New processes using copper damascene metallization have additional constraints, as many traditional chemicals are not benign to copper. - Higher speed devices are attainable with low-k dielectric materials, but these materials have special chemical requirements. Advances have been made to meet all three of these requirements by formulating chemical mixtures that are more benign, both environmentally and regarding health issues, than previously possible. These blends are water-based, water-rinsable, and free of regulated solvents, i.e., "green". The resulting technology has a very favorable cost of ownership due to lower costs related to abatement and disposal, compared to more traditional solvent blends.