The semiconductor industry is undertaking major research and development efforts to reduce the environmental impact of its manufacturing processes. In particular, technologies have been introduced to eliminate atmospheric emissions of global warming compounds, reduce solid waste and conserve energy and water resources. At each technology node, semiconductor fabrication processes are amenable to change, and implementation of sustainable manufacturing practices should be favored. However, the stringent requirements of the semiconductor fabrication process render the introduction of novel manufacturing techniques a challenge. In this talk, we present innovative concepts that have been developed and integrated within semiconductor fabrication tools. Emphasis is placed on point-of-use (POU) solutions and environmental engineering using plasma technologies. We review the requirements that must be met by green technologies to be integrated to a complex manufacturing environment. We also present arguments to demonstrate that environmentally benign manufacturing methods can be developed and implemented in an economically viable way.