| AVS 46th International Symposium | |
| Manufacturing Science and Technology Group | Wednesday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 8:20am | MS-WeM1 Low Open Area Endpoint Detection of Plasma Etching Processes B.E. Goodlin, H.H. Sawin, Massachusetts Institute of Technology |
| 8:40am | MS-WeM2 Broad Band RF Based Sensing and Control of Reactive Ion Etching C. Garvin, J.W. Grizzle, The University of Michigan |
| 9:00am | MS-WeM3 Diagnostic and Plasma Etch Endpoint Applications using Full Spectrum Optical Emission Spectroscopy H.M. Anderson, University of New Mexico, S. Gunther, W. Branagh, J. Rivers, B. Fry, CETAC Technologies |
| 9:20am | MS-WeM4 Real Time Control of Plasma Deposited Optical Filters by Multiwavelength Ellipsometry T. Heitz, P. Bulkin, A. Hofrichter, F. Chataignere, B. Drevillon, CNRS-Ecole Polytechnique France |
| 9:40am | MS-WeM5 Real Time and Run-to-Run Process Control of Plasma Processes Using Internal Machine and External Sensor Data F.H. Bell, D. Knobloch, Infineon Technologies AG, Germany, J. Zimpel, K. Voigtlaender, Fraunhofer Institute, Germany, J. Mathuni, P. Hoehmann, Infineon Technologies AG, Germany |
| 10:00am | MS-WeM6 Advanced Endpoint Capability in Plasma Processing Equipment Using Interferometer Technique T. Ni, Lam Research Corp. |
| 11:20am | MS-WeM10 Reaction Sensing in Multicomponent CVD Processes using an Acoustic Sensor L. Henn-Lecordier, G.W. Rubloff, J.N. Kidder, Jr., University of Maryland, C. Gogol, A. Wajid, Leybold Inficon Inc. |
| 11:40am | MS-WeM11 Improvements in Wafer Temperature Measurements A. Cardoso, A.K. Srivastava, Eaton SEO |