AVS 46th International Symposium
    Thin Films Division Tuesday Sessions
       Session TF-TuA

Paper TF-TuA7
Characterization Studies of Reactively Pulsed Magnetron Sputtered Alumina Films

Tuesday, October 26, 1999, 4:00 pm, Room 615

Session: Fundamentals of Si and Dielectric PVD
Presenter: P.J. Kelly, University of Salford, UK
Authors: P.J. Kelly, University of Salford, UK
P.S. Henderson, University of Salford, UK
R.D. Arnell, University of Salford, UK
Correspondent: Click to Email
It is well-established that pulsing the magnetron discharge during the reactive sputtering of insulating films, particularly alumina, can significantly reduce arc events at the target. The suppresion of arc events stabilises the reactive depositon process and, thus allows control over the coating composition, structure and properties. Fully dense, defect-free ceramic films can now be routinely produced at high depositon rates using the pulsed magnetron sputtering process. However, despite the success of this process, optimum deposition conditions and the relationships between deposition conditions and film properties are not well reported. In this investigation, alumina films have, therefore, been deposited by reactive magnetron sputtering using various combinations of DC and pulsed DC power. The deposition conditions, including pulse frequency, reverse voltage and reverse time, were systematically varied, and the coatings were characterised in terms of their structures and properties. Properties measured include nanohardness, resistivity and scratch adhesion. The optical properties of the coatings have also been investigated. In addition, the power supplies and pulse units were characterised in terms of their effectiveness at arc suppression and their suitability for particular deposition processes. A range of operating conditions have been identified over which hard arcs are fully suppressed and coatings with consistent properties are produced.